5052 Aluminum Plate for Semiconductor
Premium Material for High-Precision Electronic Manufacturing The semiconductor industry demands materials with **ultra-low impurity content**, **excellent thermal conductivity**, **superior corrosion resistance**, and **precision dimensional stability** to ensure the reliability of manufacturing equipment and chip performance. **5052 aluminum plate for semiconductor**—a 5-series Al-Mg alloy—meets these stringent requirements, serving as a critical material for semiconductor equipment components, cleanroom structures, and thermal management systems. Henan Mingtai AL. Co, Ltd. (stock code: 601677), a leading aluminum processor with 26+ years of expertise, produces high-purity 5052 aluminum plates tailored to the semiconductor industry’s needs. Compliant with ASTM B209, ISO 9001, and SEMI standards, Mingtai has become a trusted supplier for global semiconductor manufacturers.
1. Core Advantages of Mingtai’s 5052 Aluminum Plate for Semiconductor
Mingtai’s 5052-H34/H24 aluminum plate is engineered to address the semiconductor industry’s key pain points, offering four critical benefits:
Ultra-Low Impurity Content for Chip Safety: The alloy features a purity of ≥99.5%, with trace impurities (Fe, Cu, Si) controlled below 0.15%—far lower than industry averages. This prevents contamination of wafers and chip components during manufacturing, ensuring yield and performance stability.
Excellent Thermal Conductivity for Heat Dissipation: Semiconductor equipment generates significant heat during operation. 5052 aluminum plate has a thermal conductivity of 138 W/(m·K), efficiently transferring heat from high-temperature components (e.g., wafer processing chambers) to cooling systems. This maintains equipment operating temperatures within optimal ranges (20-25℃), extending service life.
Superior Corrosion Resistance for Cleanroom Environments: Semiconductor cleanrooms use chemical cleaning agents (e.g., hydrofluoric acid, isopropyl alcohol) and maintain high humidity. 5052 aluminum’s 2.2-2.8% magnesium content forms a dense oxide film, resisting chemical erosion and moisture. It passes 1000-hour salt spray tests (ASTM B117) and meets cleanroom Class 100 standards for particle emission.
Precision Dimensional Stability & Formability: The plate offers tight thickness tolerance (±0.02mm) and flatness (≤1mm/m), critical for assembling high-precision semiconductor equipment. Its elongation rate ≥12% enables bending, stamping, and machining into complex components (e.g., wafer carriers, equipment frames) without deformation.
2. Key Specifications & Technical Parameters of 5052 Aluminum Plate for Semiconductor
Mingtai provides customized solutions for diverse semiconductor manufacturing needs, with core parameters optimized for performance:
|
Alloy Grade |
Temper |
Thickness Range (mm) |
Width Range (mm) |
Key Performance Indicators |
Compliance Standards |
|
5052 Aluminum |
H24, H34, H112 |
0.5-10.0 (customizable 0.3-30mm) |
1000-2600 (customizable) |
Purity ≥99.5%; Thermal conductivity: 138 W/(m·K); Tensile strength: 230-280MPa; Elongation ≥12%; Impurity content (Fe+Cu+Si) ≤0.15% |
ASTM B209, ISO 9001, SEMI F1, GB/T 3880 |
Additional Performance Indicators
Surface Quality: Mirror-smooth with no scratches, oxidation, or particles; oil content ≤3mg/m²; compatible with cleanroom cleaning processes.
Dimensional Precision: Thickness tolerance ±0.02mm; flatness ≤1mm/m; edge straightness ≤0.5mm/m (no burrs).
Cleanliness Level: Meets SEMI F1 standards for particle count (≤10 particles/㎡, size ≥0.5μm).
Eco-Friendly: Produced with 30% recycled aluminum, aligning with the semiconductor industry’s sustainable development goals.
3. Main Application Scenarios of 5052 Aluminum Plate in Semiconductor Industry
Mingtai’s 5052 aluminum plate caters to critical links in semiconductor manufacturing:
Semiconductor Equipment Components: Used in wafer carriers, processing chamber liners, electrode holders, and equipment frames. Its low impurity content and dimensional precision ensure compatibility with high-precision assembly.
Cleanroom Infrastructure: Applied in cleanroom walls, partitions, and workbenches. Its corrosion resistance and low particle emission maintain cleanroom Class 100-1000 standards, essential for chip manufacturing.
Thermal Management Systems: Utilized in heat sinks, cooling plates, and heat pipes for semiconductor equipment. Its high thermal conductivity efficiently dissipates heat from CPUs, GPUs, and wafer processing units.
Packaging & Testing Tools: Suitable for test sockets, packaging molds, and lead frames. Its formability supports the production of custom-shaped tools for chip testing and packaging.
4. Mingtai: Trusted Supplier of 5052 Aluminum Plate for Semiconductor
Mingtai’s production capabilities and quality control systems make it a preferred partner for the semiconductor industry:
Advanced Production & Clean Manufacturing: Equipped with China’s first “1+4” hot continuous rolling line, CVC 6-roller cold rolling mills, and Class 1000 clean production workshops, Mingtai ensures ultra-low impurity content and surface cleanliness. Precision annealing furnaces eliminate internal stress, enhancing dimensional stability.
Strict Quality Assurance for Semiconductor Standards: With a CNAS-accredited testing center and 600+ professional technicians, Mingtai conducts 100% inspections, including:
Chemical composition analysis (ICP-MS) to control impurities.
Thermal conductivity and mechanical property testing.
Cleanliness testing (particle count, oil content).
Each batch includes a detailed mill test certificate (MTC) for traceability, complying with global semiconductor import requirements.
Efficient Global Supply & Customization: Mingtai supports small-batch (MOQ 1 ton) and large-scale orders, with delivery times as short as 3-30 days. Customized thickness, width, and surface treatments (e.g., anodizing, passivation) are available to match specific equipment designs.
Sustainable & Compliant Production: Certified as a “National Green Factory,” Mingtai uses energy-saving technologies and recycled aluminum, reducing carbon emissions by 18%. Products meet RoHS and REACH standards for hazardous substance control.
5. Why Mingtai’s 5052 Aluminum Plate Outperforms Alternatives for Semiconductor
Compared to other materials (e.g., 6061 aluminum, stainless steel, copper), Mingtai’s 5052 aluminum plate offers distinct advantages:
Lower Impurity Than 6061 Aluminum: 6061 aluminum has higher Si content (0.4-0.8%), increasing wafer contamination risks; 5052’s ultra-low impurities make it safer for semiconductor applications.
Lighter & More Corrosion-Resistant Than Stainless Steel: Stainless steel is heavy (increasing equipment weight) and prone to chemical corrosion; 5052 aluminum reduces weight by 60% and withstands cleanroom chemicals.
More Cost-Effective Than Copper: Copper has high thermal conductivity but is 3x more expensive and heavier; 5052 aluminum delivers optimal thermal performance at a lower cost, suitable for large-scale equipment production.
Contact Mingtai for 5052 Aluminum Plate for Semiconductor
If you’re a semiconductor manufacturer or equipment supplier seeking high-quality 5052 aluminum plate, Mingtai offers reliable, compliant solutions. Our technical team provides free sample testing and customized recommendations based on your specific application requirements (e.g., equipment type, cleanroom class).
Email: sales@mingtai-al.com
Whatsapp/Wechat: +86-17760728273
Website: www.mingtaialuminum.com
